Annual Silicon Shipments Hit Record High, Market Tops $10 Billion for First Time Since 2008

Revenues Improve but Remain Below 2007 Peak

MILPITAS, California, Jan. 30, 2019 /PRNewswire/ -- Worldwide silicon wafer area shipments in 2018 increased 8 percent year-over-year to a record high, while 2018 worldwide silicon revenue jumped 31 percent during the same period, topping the $10 billion mark for the first time since 2008, reported the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.

Silicon wafer area shipments in 2018 totaled 12,732 million square inches (MSI), up from the previous market high of 11,810 million square inches shipped during 2017. Revenues totaled $11.38 billion, compared to the $8.71 billion posted in 2017.

"For the fifth year in a row, annual semiconductor silicon volume shipments reached record levels," said Neil Weaver, chairman of SEMI SMG, and Director, Product Development and Applications Engineering, at Shin-Etsu Handotai America. "Despite strong demand and the impressive gain in revenues last year, the market still remains below the market high set in 2007."

*Total Electronic Grade Silicon Slices Excluding Non-Polished Wafers. Shipments are for semiconductor applications only and do not include solar applications.
*Shipments are for semiconductor applications only and do not include solar applications

All data cited in this release includes polished silicon wafers, such as virgin test wafers and epitaxial silicon wafers, as well as non-polished silicon wafers shipped to end users.

Silicon wafers are the fundamental building material for semiconductors, which, in turn, are vital components of virtually all electronics goods, including computers, telecommunications products, and consumer electronics. The highly engineered thin, round disks are produced in various diameters – from one inch to 12 inches – and serve as the substrate material on which most semiconductor devices, or chips, are fabricated.

The Silicon Manufacturing Group (SMG) is a sub-committee of the SEMI Electronic Materials Group (EMG) and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi, etc.). The purpose of the group is to facilitate collective efforts on issues related to the silicon industry including the development of market information and statistics about the silicon industry and the semiconductor market.

For more information on the SEMI Worldwide Silicon Wafer Shipment Statistics, click here.  

About SEMI
SEMI^® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C.  For more information, visit www.semi.org and follow SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: mhall@semi.org

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