Probe Card Market Size to Grow USD 3884.3 Million by 2029 at a CAGR of 6.5% | Valuates Reports
BANGALORE, India, Nov. 17, 2023 /PRNewswire/ -- Probe Card Market is Segmented by Type (Cantilever Probe Card, Vertical Probe Card, MEMS Probe Card), by Application (Foundry & Logic, DRAM, Flash, Parametric, Others (RF/MMW/Radar, etc.)): Global Opportunity Analysis and Industry Forecast, 2023-2029. It is Published in Valuates Reports Under the Category of Electronics & Electrical.
The global Probe Card Market was valued at USD 2478.8 Million in 2022 and is anticipated to reach USD 3884.3 Million by 2029, witnessing a CAGR of 6.5% during the forecast period 2023-2029.
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Major Trends Influencing the growth of the Probe Card Market:
A number of reasons, such as the ongoing developments in semiconductor technology, the increased complexity and miniaturization of integrated circuits, and the rising need for high-performance electronic devices, are driving the expansion of the probe card market.
The need for accurate and effective testing solutions, such as Probe Cards, increases as semiconductor makers work to create chips that are both smaller and more powerful. This is necessary to guarantee the quality and dependability of these cutting-edge semiconductor components.
Furthermore, as new technologies like 5G, the Internet of Things (IoT), and artificial intelligence require sophisticated testing methodologies to meet strict performance standards, the proliferation of applications in these areas is driving the market for probe cards to grow steadily.
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TRENDS INFLUENCING THE GROWTH OF THE GLOBAL PROBE CARD MARKET:
The market for probe cards is expanding due in large part to the unrelenting push for integrated circuit miniaturization and greater integration. The distance between individual components on a semiconductor wafer gets smaller as electrical devices get more powerful and smaller, hence finer pitches and higher precision are needed for Probe Cards. The need for sophisticated and specialized Probe Card solutions stems from the necessity of Probe Cards' ability to make precise electrical contact with closely spaced bond pads in order to evaluate the operation and performance of these tiny integrated circuits.
The market for probe cards is mostly driven by the growing complexity of semiconductor devices. Many functions, including sensors, processors, and communication modules, are combined onto a single chip in modern electronic systems. This intricacy makes thorough testing necessary in order to find and fix any possible flaws or performance problems. In order to precisely evaluate the electrical properties and functionality of a semiconductor device across its many components and guarantee the overall quality of the integrated circuits, probe cards are essential to this testing procedure.
The market for probe cards is being driven by the emergence of System-in-Package (SiP) technology, which integrates several processors into a single package. SiP technology allows electrical gadgets to have smaller form factors and more functionality. However, evaluating the integrated components inside a SiP package calls for specific testing methods, and SiP topologies provide special issues that Probe Cards are designed to meet, like complicated interconnects and varying die sizes.
The semiconductor industry is known for its requirement for reliable and accurate testing solutions at a reasonable cost. In order to meet this demand, Probe Cards are essential because they provide effective testing procedures that lower production costs by assisting in the early detection of problems in the manufacturing cycle. Probe Cards are an appealing choice for semiconductor makers who want to strike a compromise between the necessity of thorough testing and the financial benefits of mass manufacturing because of their affordability.
The market for probe cards is being driven by the emergence of System-in-Package (SiP) technology, which integrates several processors into a single package. SiP technology allows electrical gadgets to have smaller form factors and more functionality. However, evaluating the integrated components inside a SiP package calls for specific testing methods, and SiP topologies provide special issues that Probe Cards are designed to meet, like complicated interconnects and varying die sizes.
Probe Card market growth is aided by the expansion of semiconductor production globally, which is fueled by the need for electronic components in a variety of industries and geographical areas. Testing solutions that can adapt to various manufacturing environments and standards are increasingly needed as semiconductor fabrication facilities (fabs) spread throughout the world. As a crucial component of the semiconductor testing process, probe cards are being used more often in both existing and developing semiconductor manufacturing centers.
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PROBE CARD MARKET SHARE:
It is anticipated that APAC will increase significantly. Furthermore, the region's need for integrated circuits (ICs) has increased due to developments in wired and wireless technologies, the growing adoption of the Internet of Things, and the growing usage of electronics in the automobile industry. Refined integrated circuits (ICs) with increased application capabilities are in high demand. Therefore, over the projected period, the expansion of the regional market will be driven by these factors, which are also boosting the need for new fabs that can manufacture ICs.
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Key Players:
- FormFactor
- SV Probe
- Microfriend
- Korea Instrument
- Feinmetall
- Synergie Cad Probe
- Will Technology
- TSE
- TIPS Messtechnik GmbH
- MJC
- JEM
- STAr Technologies, Inc.
- MaxOne
- Shenzhen DGT
- Suzhou Silicon Test System
- CHPT
- Micronics Japan (MJC)
- Technoprobe S.p.A.
- Japan Electronic Materials (JEM)
- MPI Corporation
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